CPU Thermal Pad High Efficient Thermal Pad 12.8 W/Mk 30x30x2.5mm

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Description:

Excellent thermal conductivity: upgraded thermal conductive silicone material with a thermal conductivity of 12.8 W/mK. Our thermal pad greatly improves the heat transfer between electronic components and effectively cool the temperature in a few seconds.
Used for graphics cards, graphics chips and CPU chips: heat pad can greatly reduce the CPU temperature, solve the heat dissipation problem of most notebook computer.
Super reliable and durable: 40-200-C high temperature performance will not melt, non-toxic, tasteless, anti-corrosion, wear-resistant, anti-static, retardant, compression, insulation. Any contact with electrical traces will not cause any damage.
Easy to use: the thermal pad can be cut freely according to your needs, perfectly filling the gap between the contact surfaces.
Wide application range: it can perfectly replace the traditional composite rubber radiator and is suitable for control panel, motor, electronic products, CPU, GPU, radiator, power LED, automotive machinery, computer host, notebook computer and any heat dissipation module.

Specification:

Thermal Conductivity: 13.8w/Mk
Density: 3.3 ± 0.1
Hardness: 40-80 (SC)
Working Environment Temperature: - 40-200 ° C

Package Includes:

1 Piece CPU Thermal Pad

Thermal Pad;CPU Thermal Pad High Efficient Thermal Pad;12.8 W Mk Silicone Thermal Pad Heat Sink;Insulated Heat High Temperature Resistant;North And South Bridge Water Thermal Pad;GPU Memory Heat Sink gaming graphics card

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